Specifications for battery charger ICs
The maximum number of cells, supply voltage, quiescent current (IQ), maximum charge current, voltage accuracy, and operating temperature are crucial performance criteria for battery charger ICs. Cells, which make up batteries, are the basic building blocks. By using a battery, electrons are transported from the cathode (+) to the anode (-) through a conductive path. When a battery is charged, the flow of electrons is altered, which makes the electrochemical reaction happen backward. Batteries with a significant number of cells are best served by battery charger ICs with reasonably high supply voltages and quiescent currents. The maximum charge current for both low- and high-charge devices is typically given in amperes. The percentage variation of voltage accuracy from a nominal value is used to express it.The operating temperature is a full-required range.
Package types of Battery charger ICs
Battery charger ICs are available in a variety of IC package types. Dual in-line packages (DIPs) can be made of ceramic (CDIP) or plastic (PDIP). Grid array packages include ball-grid array (BGA), flip chip ball-grid array (FCBGA), plastic ball-grid array (PBGA), multi-chip module plastic ball-grid array (MCM-PBGA), tape ball-grid array, fine-pitch land-grid array (FLGA), pin grid array (PGA), and interstitial package grid array (IPGA). Chip scale packages or chip size packages (CSPs) have an area that is no more than 20% larger than the built-in die. CSP variants include flip chip CSP (FCCSP) and wafer-level chip-scale package (WLCSP). Quad flat packages (QFPs) contain a large number of fine, flexible, gull wing shaped leads. QFP variants include low quad flat package (LQFP), thin quad flat package (TQFP) and quad flat non-leaded package (QFM). Other IC package types for battery charger ICs include small outline package (SOP), mini small outline package (MSOP), small outline integrated circuit (SOIC), small outline J-lead (SOJ), shrink small outline package (SSOP), and thin shrink small outline L-leaded package (TSSOP). Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. Thin dual no-lead (TDFM) packages are fine-pitch, high-performance replacements for 6-pin SOT23 and SC-70 packages.
All Common Battery Types Are Compatible With the Battery Charger IC
Offered in a small-outline TSSOP-16 with a 1.2 mm height profile, the Si9731DQ works with the system microprocessor or microcontroller in cell phones, PDAs and other handheld appliances to provide a complete, chemistry-independent battery charger.
The Si9731DQ is a full, chemistry-independent battery charger available in a small-outline TSSOP-16 with a 1.2 mm height profile that integrates with the system CPU or microcontroller in mobile phones, PDAs, and other handheld devices. Depending on the battery voltage at the start of the charge cycle, the gadget uses two internal power MOSFETs to deliver trickle charging or fast charging. Power dissipation is reduced to a minimum since it employs a pulse charging mechanism with brief on-times and lengthy off-times, thus no external inductor is needed. The microprocessor-controlled charger allows the same IC to be used for lithium ion or nickel battery designs, different charger types, different charging algorithms, and different power management architectures. The charger can be used in conjunction with a regulated or unregulated external dc power source, including most low-cost wall adapters rated from 4.5V to 12V. Production quantities are available in Bitfoic with lead times of 10 to 12 weeks for larger orders, priced at $1.40 each/100,000.
Common Problems of Battery Charger IC in Phones?
1. Manufacturer defects
Sometimes IC problems in your phone are directly from the manufacturer's defects. If you bought a faulty unit right from the onset, chances are it gets IC problems afterward.
However, that’s not only what causes IC problems.
2. Power surge
High power can cause irreparable damage to your IC. For instance, charging your phone with an overrated charger (with a higher amount of current output than what your phone can handle) may cause a power surge.
A power surge may also occur if your phone is struck by thunder and lightning while charging it. So, if your phone IC got damaged, it can be traced easily to a power surge that happened earlier.
3. Moisture
Another prominent cause of IC damage in phones has moisture content in it. It usually happens when your phone is too cold, or when it falls into the water. And with that, moisture could damage sensitive components of your device, including the IC.
